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Title :短パルスレーザを用いた絶縁基板内部へのレーザアシスト3次元微細配線技術の開発
Title alternative :Development of laser-assisted three-dimensional-wiring technology inside insulated substrates by short pulse irradiation
Authors :山崎, 和彦
Authors alternative :YAMASAKI, Kazuhiko
Issue Date :31-May-2011
Abstract :短パルスレーザを用いたレーザアシスト3次元微細配線技術の実現性の把握のため、ポリイミド基板内部に短パルスレーザを照射したところ、数~20μmの無数の微小空洞からなる幅約20~30μm、長さ約250~270μmの改質領域の形成を確認した。基板内部への連続的なマイクロチャンネルの加工には至らなかったものの、無酸素濃度環境下での銀ナノ粒子のレーザ焼結に成功し、マイクロチャンネル内にあるナノ粒子のレーザ焼結の可能性を示した。
To confirm the feasibility of the laser-assisted three-dimensional-wiring technology, near-infrared short pulses were irradiated inside polyimide substrates. As a result, formation of modified polyimide with 20-30 μm in width and 250-270 μm in length was observed. The regions consist of a lot of micro voids with 20 μm or less in size. Although fabrication of continuous micro-channels inside the substrate could not be achieved, we succeeded in carrying out laser sintering of Ag nano-particles under oxygen-free condition. This indicates possibility of the laser sintering of the particles in micro-channels.
Type Local :科研等報告書
Publisher :茨城大学
URI :http://hdl.handle.net/10109/2597
Appears in Collections:Grants-in-aid for scientific research Report (College of Engineering)

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